Message
Huawen® SMA Resin (styrene maleic anhydride copolymer) is a suitable epoxy crosslinker that meets the needs of the electronics market. As an epoxy crosslinker in prepregs for copper clad laminates/printed circuit boards (CCL/PCB), it meets the performance requirements of PCB laminates and the demanding demands of the CCL industry.
As an epoxy curing agent for CCL/PCB applications, Huawen® SMA Resin improves thermal performance, peel strength, and adhesion, and offers advantages such as a low coefficient of thermal expansion and excellent dielectric properties.
