Huawen® SMA resins (styrene maleic anhydride copolymers) are suitable epoxy crosslinking agents that meet the demands of the electronics market. As epoxy crosslinking agents for copper-clad laminates/printed circuit boards (CCL/PCB) in prepreg laminates, they can meet the performance requirements of PCB laminates and the stringent needs of the CCL industry.

As epoxy curing agents for CCL/PCB, Huawen® SMA resins improve thermal performance, peel strength, and adhesion, while offering advantages such as low thermal expansion coefficient and excellent dielectric properties.